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GaAs DPDT Switch DC - 2 GHz
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MASW2040
V 2.00
Cascadable Low Insertion Loss Low DC Power Consumption Low Distortion Operation (Quiet Mode) Useful as a Building Block for - Digital - Digital - Digital - Digital Attenuators Delay Lines Phase Shifters Switched Filter Elements
Typical Performance @ +25C
Guaranteed Specifications** -55C to +85C
Frequency Range Insertion Loss DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 2.0 GHz 0.4 dB Max 0.4 dB Max 0.6 dB Max 1.1:1 Max 1.2:1 Max 1.2:1 Max 25 dB Min 20 dB Min 15 dB Min
VSWR
Isolation
Operating Characteristics
Impedance Switching Characteristics tRISE, tFALL (10/90% or 90/10% RF) tON, tOFF (50% CTL to 90/10% RF) Transients (In-Band) Input Power for 1dB Compression Control Voltages (Vdc) 0/-5 0.05 GHz +24 dBm 0.5 - 2 GHz +30 dBm Intermodulation Intercept Point (for two-tone input power up to +5 dBm) Intercept Points IP2 0.05 GHz +62 0.5 - 2 GHz +68 dBm 50 Nominal 3 ns Typ 6 ns Typ 20 mV Typ 0/-8 +25 dBm Typ +33 dBm Typ
IP3 +39 dBm Typ +46 dBm Typ
Control Voltages (Complementary Logic) VINLow 0 to -0.2V @ 9 A Max VINHi -5V @ 25 A Typ to -8V @ 75 A Max Die Size 0.045" x 0.038" x 0.010" (1.13mm x 0.97mm x 0.25mm)
**All specifications apply with 50 impedance connected to all RF ports, 0 and -5 Vdc control voltages. *** Loss change 0.0025dB/C (-55C to +85C)
Schematic
Handling, Mounting, Bonding Procedure
MASW2040
V 2.00
Handling Precautions
Permanent damage to the MASW2040 may occur if the following precautions are not adhered to: A. Cleanliness -- The MASW2040 should be handled in a clean environment. DO NOT attempt to clean unit after the MASW2040 is installed. B. Static Sensitivity -- All chip handling equipment and personnel should be DC grounded. C. Transient -- Avoid instrument and power supply transients while bias is applied to the MASW2040.Use shielded signal and bias cables to minimize inductive pick-up. D. Bias -- Apply voltage to either control port A or B only when the other is grounded. Neither port should be allowed to "float". E. General Handling -- It is recommended that the MASW2040 chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers.
Truth Table
Control Inputs
A V INHI VINL OW B VINLOW V INHI RF1 - RFA1 OFF ON
Condition of Switch
RF1 - RFB1 ON OFF RF2 - RFA2 OFF ON RF2 - RFB2 ON OFF
VINLOW = 0.0 TO -0.2V V INHI = -0.5V
Maximum Ratings A. Control Value (A or B): B. Max Input RF Power: C. Storage Temperature: D. Max Operating Temperature: -8.5 Vdc +34 dBm (500 MHz- 4 GHz) -65C to +175C +175C
Mounting
The MASW2040 is back-metallized with Pd/Ni/Au(100/1,000/ 10,000A) metallization. It can be die-mounted with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255C and a tool temperature of 265C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290C. B. DO NOT expose the MASW2040 to a temperature greater than 320C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MASW2040 into position. A thin epoxy fillet should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy may be used but is not required.
BondPad Dimensions -- Inches (mm) RF1, RF2 RFA1, RFB1 RFA2, RFB2 A, B, Ac, Bc 0.004 x 0.008 (0.100 x 0.200) 0.004 x 0.005 (0.100 x 0.125) 0.004 x 0.005 (0.100 x 0.125) 0.004 x 0.004 (0.100 x 0.100)
Die Size -- Inches (mm) 0.045 x 0.038 x 0.010 (1.13 x 0.97 x 0.25)
Wire Bonding
A. Ball or wedge with 1.0 mil diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground

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